A CIC (Cell-Interconnect-Coverglass) assembly integrates the triple-junction GaAs cell, the interconnect and the coverglass into one unit ready for lay-down on an array substrate. Interconnect soldering and coverglass bonding are completed before delivery, and a bypass diode is integrated to protect adjacent cells in the string during shading or failure.
| Item | Specification |
|---|---|
| Cell structure | Triple-junction GaInP/GaAs/Ge on germanium substrate |
| Typical sizes | 4×8 cm (80.15×40.15 mm) / 4×6 cm / 4×3 cm, customizable |
| Cell area | 30.15 cm² (4×8 cm format) |
| Thickness | 0.36 ± 0.02 mm |
| Areal density | (125 ± 12) mg/cm² |
| Anti-reflection coating | TiOx / Al2O3 |
| Coverglass | KFB120, 120 ± 20 μm |
| Interconnect | Silver / silver-plated Kovar, 20 / 25 μm |
| Diode protection | Integrated bypass diode: Vf(620 mA) ≤ 1.0 V, Ir(4.0 V) ≤ 50 μA |
| Item | Specification |
|---|---|
| Open circuit voltage Voc | 2740 mV |
| Short circuit current density Jsc | 17.4 mA/cm² |
| Maximum power voltage Vm | 2430 mV |
| Maximum power current density Jm | 16.7 mA/cm² |
| Conversion efficiency η | 30% |
| Fill factor FF | 0.850 |
| Fluence | Pm/Pmo |
|---|---|
| 1×10¹⁴ e/cm² | 0.95 |
| 5×10¹⁴ e/cm² | 0.90 |
| 1×10¹⁵ e/cm² | 0.86 |
Array power for LEO, MEO and GEO missions.
1U / 3U / 6U standard panels and custom formats.
Custom interconnect, coverglass and diode configuration.
Practice-series and remote sensing satellites.
